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JerryRigEverything has put Google’s new Pixel 9 Pro Fold to the test with a detailed durability assessment. The phone was subjected to both a bend test and a teardown to evaluate its sturdiness. Contrary to expectations, the hinge wasn’t found to be the weakest part. The phone’s exterior, including the hinge, is made from “aerospace-grade high-strength aluminum alloy,” which appears to enhance its durability.
Screen Resistance
The Pixel 9 Pro Fold’s outer cover screen, made from Gorilla Glass Victus 2 and known as Actua, scratches at a level six, with deeper grooves appearing at a level seven. In contrast, the inner display, referred to as Super Actua and composed of Ultra Thin Glass, shows scratches at level two and can be scratched by fingernails. This suggests that while the outer screen is relatively scratch-resistant, the inner display is more prone to damage.
Durability
Hinge Performance and Dust Vulnerability
The Pixel 9 Pro Fold’s hinge is crafted from “multi-alloy steel,” but it tends to grind when exposed to dirt and sand because it lacks dust protection (IPX8). While the device passes bend tests without issues when closed, problems arise when it is open and bent from the back. The back panels meet over the hinge’s spine but provide minimal resistance.
Design Flaw
Antenna Lines and Hinge Durability
The Pixel 9 Pro Fold inherits a design flaw from last year’s model: the antenna lines positioned near the hinge. During the bend test, these lines on the cover screen side caused the display to detach from its case. Despite this, the hinge of the Pixel 9 Pro Fold managed to endure the stress test, unlike the Samsung Z Fold6, which uses a locking mechanism to prevent severe bending.
Internal Structure
Teardown Reveals Components and Heat Management
iFixit’s recent teardown of the Pixel 9 Pro Fold uncovered a larger battery located beneath the cover screen, with a smaller battery and motherboard in the other half of the device. The USB-C port is mounted on its own board, simplifying repairs. A vapor chamber was discovered beneath the battery and Tensor G4 processor. Most of the thermal heat dissipation happens from the back or internal side of the device when closed, with heat traveling from the processor to the vapor chamber and then to the center of the Fold.
